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Vision 310 MK II PECVD
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Our systems
The Vision 310 MK II PECVD (Plasma Enhanced Chemical Vapour Deposition) system is one of the most versatile and flexible plasma deposition systems available today. The system is based on the robust control platform DeviceNet ensuring reliable and troublefree operation. The system is capable of depositing a number of different films, including, Silicon Dioxide (SiO2), Silicon Nitride (SiN), Silicon Oxynitride (SiON), Silicon Carbide (SiC) and amorphous Silicon (a-Si). The substrate table on the system is 305mm in diameter allowing processing on a diameter up to 270mm in diameter.
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Deposition processesRead more about our processes in the process datasheets attached. For further information don´t hesitate to contact us. . Read more »
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Vision 310 Mk II PECVDFlexible open load plasma deposition tool capabable of depositing films (SiO2, Si3N4, SiC, a-Si) on a wide variety of substrates up to 10" in diameter. Please find more information about Vision 310 PECVD system below.
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Locally GloballyWe support you globally through our partners and distributors.
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Vision latest newsletterRead the latest news about the Vision platform, development and upgrades.
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Advanced Vacuum AB Järngatan 12 234 35 Lomma T +46 40 534070 F +46 40 411318 |
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